APPEARANCE INSPECTION OF ICS
ovitAn acquaintance of mine from a company that is mainly in charge of maintenance of visual inspection equipment for ICs came to visit me.
We then asked him about the actual situation of semiconductor-related visual inspection equipment.
Apparently the key is "foreign body".
WHAT I FELT WHILE LISTENING TO THE CONVERSATION WAS THAT THE THEME OF VISUAL INSPECTION OF ICS HAS BEEN AROUND SINCE THE DAWN OF IMAGE INSPECTION, AND THAT BECAUSE THE METHOD OF "MEASURING BETWEEN LEADS" BECAME THE DE FACTO STANDARD AT THAT TIME, IT HAS BECOME DIFFICULT TO DEAL WITH "FOREIGN MATTER" THAT CANNOT BE HANDLED BY "MEASUREMENT.
IF WE GO WITH THE FI WAY OF THINKING.
- There is nothing wrong with "foreign matter" as a point of difference from good products.
- The measurements are different because the images are different. If we inspect the images to see if they are different, we can also see that the measurements are different.
- CAN WE SAY THAT AN OBJECT IS OK BECAUSE ONLY A FEW MEASUREMENTS ARE OK? IT IS DIFFICULT TO SAY THAT THE OBJECT IS OK EVEN IF SEVERAL HUNDRED OR SEVERAL THOUSAND POINTS ARE MEASURED. AS LONG AS THE INSPECTION IS DONE WITH IMAGES, THERE IS NO MORE RELIABLE METHOD THAN THE LOGIC THAT "THE ENTIRE IMAGE IS THE SAME AS A GOOD PRODUCT.
It is like that.
In the semiconductor industry, where "image measurement" remains deeply rooted,
- Judge everything and select only the good products.
- It is highly versatile and overwhelmingly easy to operate.
- WE ALREADY HAVE A TRACK RECORD WITH MORE PRECISE OBJECTS SUCH AS LEADFRAMES AND FPCS.
- It just doesn't give measurements. No classification of defects. (It is possible, but I doubt if the effect is worth the trouble.)
IT WOULD BE INTERESTING TO INTRODUCE AN IC (ALSO CAPABLE) VISUAL INSPECTION SYSTEM CALLED
IT IS STRANGE TO TALK ABOUT NEXT YEAR AT THIS EARLY STAGE IN NOVEMBER, BUT WE HAVE TIED UP WITH AN EQUIPMENT MANUFACTURER TO RELEASE SEVERAL "FI-EQUIPPED VISUAL INSPECTION SYSTEMS FOR XX". I AM VERY MUCH LOOKING FORWARD TO IT.
